New Epoxy Diluent & Modifiers for Electronics Adhesives - Cardolite at ASC Convention

    Cardolite will be promoting newly developed diols, epoxy curing agents, and CNSL modifiers for adhesives and sealants applications at the ASC convention in Miami, Florida on April 23-25, 2018.

    Low Total Chlorine and Halogen Content

    In particular, Cardolite will introduce epoxy diluent and modifiers with very low total chlorine and halogen content that are suitable for electronics adhesives. 

  Please visit at booth 719 to learn more about CNSL Epoxy and Polyurethane technology offerings.