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Master Bond推出电子工业用双组份环氧多硫化合物

来源:林中祥胶粘剂技术信息网2015年05月26日

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Master Bond introduces EP21TPFL-1AO, an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU in/ft2 hr °F [1.30-1.44 W/(m K)]. 

As a polysulfide based system, EP21TPFL-1AO has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. EP21TPFL-1AO has unusual blend of properties, enables EP21TPFL-1AO to be a candidate for a variety of bonding, sealing, coating and encapsulation applications in the electronic, aerospace, specialty OEM and related industries.

With an elongation of 150-200%, EP21TPFL-1AO offers a high degree of flexibility and it can withstand intense thermal cycling and mechanical shock. EP21TPFL-1AO is a low viscosity system also has a hardness of 70-90 Shore A. The mix ratio is a forgiving two to three by weight or volume. Color coding facilitates mixing. Part A is black and Part B is off-white. Working life is a conveniently long 90-120 minutes at 75°F. 

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