Rogers Corporation Launches COOLSPAN TECA Film for Electronics

Chandler, AZ -- Rogers Corporation (NYSE: ROG)Advanced Circuit Materials Division launched COOLSPAN Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.

COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. This film provides both a thermally and electrically conductive bond interface.

COOLSPAN TECA Film is supplied in sheet form on a PET carrier and is easy tohandle when converting into preforms and when peeling from the carrier. It is able to survive lead-free solder processing and offers outstanding chemical resistance and high temperature performance, helping you to keep things cool.

COOLSPAN TECA Film has been demonstrated to easily survive 5X lead-free solder exposures, 1000 hours at 85C/85%RH, and 190C for ten days.

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global technology leader in specialty materials and components for consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure. With more than 180 years of materials science and engineering experience, Rogers provides product designers with solutions to help them power, protect and connect our world with greater reliability, efficiency and performance. Rogers’ three core businesses include Power Electronics Solutions for high-voltage rail traction, energy efficient power drives, wind and solar power conversion; High Performance Foams for cushioning, sealing and impact protection in tablets and smart phones, aircraft, rail and automotive inte