Assembly Adhesive suits edgebonding applications.

Assembly Adhesive suits edgebonding applications.

Click Here to Enlarge Picture

Designed for rapid ruggedization of circuit board components, Ultra Light-Weld 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As product cures, blue color transitions to colorless.