EO-83M-2 is a single component, highly silver filled epoxy adhesive designed for PCB and semiconductor die attach applications using snap cure profile. EO-83M-2 is recommended for small die attach applications such as LEDs and LED arrays as well as laser-diode and photo-diode applications. This versatile product is applicable for die attach from as small as 10 mil x 10 mil up to 250 mil x 250 mil. EO-83M-2 can cure in thin films and small dies in as quickly as 1 minute at 175°C. It is also compatible with high volume automated syringe dispensing and SMT automated systems.
Epoxysets core belief is to provide quality products with unprecedented service to our customers. Epoxyset is a custom formulator of epoxies, silicones and urethanes for demanding applications in MicroElectronics / Electronics, Aerospace, Automotive, Medical and Industrial applications.
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