Bergquist Introduces Liqui-Bond® SA 3505 Liquid Silicone Adhesive for Electronics

The Bergquist Company is excited to introduce Liqui-Bond® SA 3505, the latest member of its liquid silicone adhesive line. At 3.5 W/m-K, Liqui-Bond® SA 3505 offers a high thermal conductivity previously unavailable in a structural adhesive.

Liqui-Bond® SA 3505 is a two-component, liquid silicone adhesive that is ideal for power supplies and discrete applications. Because Liqui-Bond® SA 3505 is supplied as a two-part liquid, refrigeration is not required.

About Bergquist

The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Gap Pad® and Liqui-Form™ electrically insulating gap filling materials, Sil-Pad® thermally conductive interface materials, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, Liqui-Bond® liquid adhesives and Thermal Clad® insulated metal substrates.