Encapsulant/Adhesive suits printer head, circuit assembly jobs.

Encapsulant/Adhesive suits printer head, circuit assembly jobs.

Click Here to Enlarge Picture

Exhibiting fracture toughness as well as chemical resistance to inks, 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. Product adheres to flexible circuits, FR4, and metal substrates and meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.