EV Group Introduces LowTemp Debonding Platform Featuring Range of Qualified Adhesives

ST. FLORIAN, Austria -- EV Group (EVG) a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain. The platform includes two new debonding processes that have been qualified for EVGs high-volume production temporary bonding/debonding (TB/DB) systems-UV laser debonding and multilayer adhesive debonding-in addition to EVGs ZoneBOND technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets. EVGs LowTemp debonding platform is complemented by a supply chain of seven material suppliers, with a wide choice of qualified adhesives that support a variety of bonding applications and offer greater process flexibility for customers.

EV Groups LowTemp room-temperature debonding platform is available on the companys temporary bonding/debonding systems, including the EVG850TB/DB XT Frame platform.

"For more than 15 years, EVG has provided leading-edge temporary bonding and debonding solutions to our customers," commented Paul Lindner, EVGs executive technology director. "The experience and know-how that weve built up from our numerous installations in high-volume manufacturing has taught us that one solution doesnt fit all applications when it comes to temporary bonding/debonding. Accordingly, EVG offers highly flexible and modular equipment, a wide choice of qualified materials to support customers individual requirements and multiple source policies, and process development and implementation support through our worldwide application labs and cleanroom infrastructure across a range of applications-including interposers, stacked memory, memory on logic, power devices and compound semiconductors."

EVGs LowTemp debonding platform adds to the companys already comprehensive portfolio of temporary bonding/debonding and thin-wafer handling solutions based on tape debonding and thermal slide-off debonding technology. The LowTemp debonding platform is available on EVGs full line-up of TB/DB systems, including the recently announced EVG850TB/DB XT Frame high-volume production platform, which can achieve a throughput of more than 40 wafer stacks per hour and features an optional, integrated in-line metrology module that takes up to 300,000 measurement points at unprecedented speeds to enable real-time monitoring of the bonding/debonding process for maximum yields.

About EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS) compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.