Epoxyset Introduces EPOXIBOND-485 for Bonding Metal & Ceramic Substrates in Heat Sink Applications

EPOXIBOND-485 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. It features a low coefficient of thermal expansion and good bond strength. Typically EB-485 is used with our EH-9 but can be used a variety of other hardeners. Used with our EH-21LP, the epoxy system can be used at cryogenic temperatures and has excellent thermal cycling properties.

EB-485 is used in applications that requires a thermally conductive adhesive for thermal management. A typical use of EB-485 is bonding metal and ceramic substrates in heat sink applications. Its non-sag properties allow it to be used several different applications and room temperature curing allows for low stress bonds.

About Epoxyset

Epoxysets core belief is to provide quality products with unprecedented service to our customers. We are a custom formulator of epoxies, silicones and urethanes for demanding applications in MicroElectronics / Electronics, Aerospace, Automotive, Medical and Industrial applications.