Engineered Materials Systems Launches 535-18M-57 UV Cured Epoxy Adhesive

Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.

535-18M-57 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new nonconductive UV cured adhesive cures rapidly when exposed to high-intensity UV light. 535-18M-57 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.

EMS 535-18M-57 UV Cure Adhesive was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-18M-57 is the latest addition to Engineered Material Systems extensive line of electronic materials.

About Engineered Materials Systems

Engineered Materials Systems, Inc. is dedicated to supplying the highest quality products to the market. The company has acquired all of the coveted quality certificates required in the Encapsulant, Conductive and Adhesive Industry, including ISO 9001 and TS16949. It maintains a highly integrated system of checks and balances that ensures each batch is delivered on time and is consistent within the stringent demands set forth by the customer.