This article reviews pressure sensitive adhesives that use microspheres to achieve repositionability. It will examine some of the state-of-the-art materials that are being employed and the mechanism that is being used to perform the repositioning function. Specific applications and market segments where these adhesives are being used will also be identified. Often one requires a pressure sensitive adhesive (PSA) bond that is not permanent, and the substrates need to be purposely "detached" at a certain time. Uses for such adhesives include nonstructural applications such as removable labels, masking tape, surface protection films, easily placeable and removable notepaper, and bonding credit cards to mailers. Applications can even include structural applications such as tooling placement, prototyping, and the assembly of parts for eventual reuse or recycling. There are various types of removable pressure sensitive adhesives available to the end-user depending on the degree of bond strength required.